Welcome Message

Welcome to the homepage of the research project “Smart Solar Energy Harvesting, Storage and Utilization” (HK$60.33M) funded by the Research Grants Committee, Hong Kong University Grants Committee of the Hong Kong Special Administrative Region, under the Theme-based Research Scheme (Third round, 2013). This 5-year project was launched in Jan 2014 and is aimed at addressing the urgency of developing clean and renewable energy resources to replace fossil fuels, given the fast-growing demand for energy and the recognition of man-made global climate change. The approach adopted in this project is harvesting energy directly from sunlight by using photovoltaics (PV), photocatalysis and artificial photosynthesis, which in turn developing efficient and smart energy storage systems to ensure reliable energy supply, and increasing the penetration of solar energy utilization. All of these issues are in line with the strategic objectives on sustainable development outlined by the Hong Kong Government in 2005.

The research team consists of more than 20 professors from The Chinese University of Hong Kong, The Hong Kong Polytechnic University, The Hong Kong University of Science and Technology, and The University of Hong Kong. They formed six subgroups, each led by an senior expert in the field. The project is actively progressing and we welcome your comments, suggestions, support, and collaborations.




Prof. Ching-Ping Wong
Project Coordinator
Dean of Engineering, The Chinese University of Hong Kong

About Professor CP Wong

Professor C.P. Wong is currently Dean of Engineering of The Chinese University of Hong Kong and Choh-ming Li Professor of Electronic Engineering.  He received his BS degree from Purdue University, and MS and PhD degree from Pennsylvania State University. After doctoral study, he was awarded postdoctoral fellowship under Nobel Laureate Prof. Henry Taube at Stanford University. Prior to joining Georgia Tech, he was with AT&T Bell Laboratories for many years and became an AT&T Bell Laboratories Fellow (the highest technical award bestowed by AT&T Bell Labs) in 1992. Published extensively over 1,000 technical papers and 12 books, he yielded fruitful research results and holds over 65 US patents. He made significant contributions to the industry by pioneering new materials, which fundamentally changed the semiconductor packaging technology. He is a Member of US National Academy of Engineering (elected in 2000), and Foreign Academician member of Chinese Academy of Engineering (elected in 2013).

汪正平教授現為香港中文大學工程學院院長及卓敏電子工程學講座教授。汪教授在美國普渡大學取得科學學士學位,並在賓夕法尼亞州州立大學取得哲學博士學位。其後,他獲獎學金,赴史丹福大學師從諾貝爾獎得主Henry Taube教授從事博士後研究。汪教授在研究上取得豐碩的成果,已經發表了逾1,000篇專業論文,撰寫及編輯12本書籍,並持有超過65項美國專利。汪教授通過開拓新的材料,從根本上改變了半導體封裝技術,為業界作出重要貢獻。汪教授於2010獲選為美國工程院院士,及於2013年獲選為中國工程院外籍院士。

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